Slurry Wire Saws are today established as the most commonly used tool to slicewafers from ingots, for the Semiconductor industry and for the rapidly growing sector of Photovoltaic (solar) power. Wire Saws slice many types of hard or brittle materials, most predominantly Silicon, but also other materials such as Quartz, Germanium, Gallium Arsenide, Gallium Nitride, Indium Selenide, Lithium Niobate.
Through the use of precisely controlled SIKA® WS grits, our customers can achieve, according to their own needs, precise cut-rates while limiting Total Thickness Variation, Warp, Bow and Sub Surface Damage to the wafers.
Saint-Gobain has been a pioneer in SiC micro grits for the wire sawing application. Our SIKA® WS product range is available in FEPA or JIS standard particle size distributions, Blocky- or Sharp-shape grits, Green or Black crystal grades, with various treatment possibilities.
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We are thrilled to announce the acquisition of the Silicon Carbide business by OpenGate Capital. OpenGate is a leading global private equity firm specialized in corporate carve-outs.
The new company name will be Fiven. You can still contact us through this site and the phone numbers / email addresses known to you for the moment. We are eagerly working on a new website and will be happy to welcome you as a visitor soon on www.fiven.com.
If you are looking for information on Saint-Gobain Silicon Carbide India please go to: https://www.grindwellnorton.co.in/silicon-carbide-business