Slurry Wire Saws are today established as the most commonly used tool to slicewafers from ingots, for the Semiconductor industry and for the rapidly growing sector of Photovoltaic (solar) power. Wire Saws slice many types of hard or brittle materials, most predominantly Silicon, but also other materials such as Quartz, Germanium, Gallium Arsenide, Gallium Nitride, Indium Selenide, Lithium Niobate.
Through the use of precisely controlled SIKA® WS grits, our customers can achieve, according to their own needs, precise cut-rates while limiting Total Thickness Variation, Warp, Bow and Sub Surface Damage to the wafers.
Saint-Gobain has been a pioneer in SiC micro grits for the wire sawing application. Our SIKA® WS product range is available in FEPA or JIS standard particle size distributions, Blocky- or Sharp-shape grits, Green or Black crystal grades, with various treatment possibilities.
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